TPS Engineer/Expert

Key Responsibilities 1.Lead the design, development, and iteration of critical hardware components for wafer-level ECD equipment, including plating cells, anode/cathode assemblies, wafer chucking mechanisms, electrolyte circulation systems, and precision motion control modules. Ensure designs align with ECD process requirements (e.g., uniform electrolyte flow, stable electrical contact, and contamination control) and semiconductor industry standards (SEMI). 2.Collaborate closely with process engineers, electrical engineers, and software teams to integrate ECD process constraints into hardware design. Translate process needs (e.g., precise current/temperature control, in-situ monitoring) into actionable hardware specifications, and validate that designed components enhance process performance (e.g., film uniformity, defect reduction). 3.Oversee the fabrication of hardware prototypes, conduct rigorous functional, performance, and reliability testing (e.g., thermal cycling, vibration resistance, corrosion testing for chemical compatibility). Analyze test data, identify design flaws, and implement iterative improvements to meet equipment performance targets. 4.Evaluate and qualify key hardware components (e.g., sensors, actuators, pumps, valves, corrosion-resistant materials) from suppliers. Ensure components meet requirements for chemical compatibility with ECD electrolytes, long-term reliability in semiconductor manufacturing environments, and cost-effectiveness. 5.Optimize hardware designs for scalable manufacturing, including ease of assembly, maintenance, and repair. Develop assembly drawings, bill of materials (BOMs), and technical specifications for production teams, and provide on-site support during pilot production and equipment assembly. 6.Partner with customer technical teams (foundries, IDMs) to understand their ECD equipment hardware needs and incorporate feedback into design iterations. Support sales and application teams by providing technical expertise during customer demos, equipment trials, and troubleshooting of hardware-related issues. 7.Create and maintain comprehensive hardware design documentation, including 3D models, 2D drawings (CAD), design verification reports, failure mode and effects analysis (FMEA), and standard operating procedures (SOPs). Contribute to the development of intellectual property (patents) for innovative hardware designs and configurations. 8.Stay updated on the latest advancements in semiconductor equipment hardware, including precision motion control, corrosion-resistant materials, and in-situ metrology integration. Propose innovative hardware solutions to address emerging ECD process challenges for sub-5nm technology nodes. Required Qualifications 1.Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering (Hardware Focus), or a related field. 5+ years of experience in hardware design and development for semiconductor equipment, preferably wet processing tools (ECD, cleaning, etching) or precision industrial equipment. 2.Deep technical knowledge of electrochemical plating principles. Hands-on experience with ECD equipment operation, process optimization, and defect troubleshooting in a semiconductor R&D or manufacturing environment. Familiarity with 300mm wafer processing is highly preferred. 3.Strong understanding of semiconductor equipment design fundamentals, particularly for wet processing tools (ECD, cleaning, etching). Experience collaborating with mechanical/electrical engineering teams on equipment-process integration is a plus.