工艺/产品技术支持

1. 主导设备的开发、硬件适配优化及参数精调；针对光刻胶涂布、显影、前后烘、冷却及晶圆传输等核心工序开发并迭代工艺方案，制定转速、时长、温控曲线、药液供排流量/压力等关键参数，搭建稳定可靠的工艺平台，保障膜厚均匀性、极低缺陷率，且完全符合SEMI及晶圆厂制造标准。 Lead the development, hardware adaptation optimization and parameter fine-tuning of wafer-level coating and development equipment; develop and iterate process schemes for core processes including photoresist coating, development, pre- and post-baking, cooling and wafer handling. Formulate key parameters such as rotation speed, processing time, temperature control profiles, chemical supply/discharge flow rate and pressure, build a stable and reliable process platform, ensure film thickness uniformity and extremely low defect rate, and fully comply with SEMI and wafer fab manufacturing standards 2. 与机械、电气、软硬件工程团队深度协同，将前道光刻工艺需求转化为可落地的设备硬件设计指标；针对旋涂杯、显影喷淋模组、冷热盘单元、晶圆传输臂、药液供排回收系统等核心硬件模块提供专业技术支持，优化工艺与硬件的适配性，提升设备硬件稳定性及工艺重复性。 Collaborate deeply with mechanical, electrical, software and hardware engineering teams to translate front-end lithography process requirements into implementable equipment hardware design specifications; provide professional technical support for core hardware modules including spin coating cups, development spray modules, hot and cold chuck units, wafer handling arms, and chemical supply/discharge recovery systems. Optimize the compatibility between processes and hardware, and improve equipment hardware stability and process repeatability. 3. 主导涂胶显影设备硬件关联缺陷分析与故障排查，覆盖膜厚不均、图形畸变、颗粒污染、药液残留及硬件导致的工艺异常；联动量测与失效分析团队开展深度根因定位，推动硬件整改、参数优化及结构改良，持续提升工艺良率。 Lead hardware-related defect analysis and troubleshooting for coating and development equipment, covering issues such as non-uniform film thickness, pattern distortion, particle contamination, chemical residue and process abnormalities caused by hardware. Cooperate with metrology and failure analysis teams to conduct in-depth root cause localization, drive hardware rectification, parameter optimization and structural improvement, and continuously enhance process yield. 4. 有能力对涂胶显影设备核心硬件及配套化工材料评估与认证；制定符合安规及环保要求的药液管控、存储及日常维保规范，优化硬件维保策略，降低设备宕机时长与运营成本。 Capable of evaluating and certifying core hardware of coating and development equipment and supporting chemical materials; formulate chemical management, storage and daily maintenance specifications in compliance with safety and environmental regulations, optimize hardware maintenance strategies, and reduce equipment downtime and operating costs. 5. 对接客户技术团队，明确现场设备硬件与工艺需求，提供设备量产爬坡全流程技术支持； Contact with customer technical teams, clarify on-site Track equipment hardware and process requirements, and provide full-process technical support for equipment mass production ramp-up. 任职要求 化学工程、材料科学、机械工程、电气工程等相关工科专业本科及以上学历。5年及以上半导体行业相关工作经验。 Bachelor’s degree or above in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering or related engineering majors, with 5 years or more of relevant working experience in the semiconductor industry.